Power chips are attached to exterior circuits through packaging, and their efficiency depends on the support of the product packaging. In high-power scenarios, power chips are generally packaged as power components. Chip interconnection describes the electric connection on the top surface area of the chip, which is usually aluminum bonding cable in standard components. ^
Standard power component bundle cross-section
Currently, business silicon carbide power modules still mainly use the product packaging modern technology of this wire-bonded traditional silicon IGBT module. They face problems such as large high-frequency parasitic criteria, insufficient warmth dissipation ability, low-temperature resistance, and not enough insulation stamina, which limit making use of silicon carbide semiconductors. The display of excellent efficiency. In order to resolve these problems and fully manipulate the massive possible advantages of silicon carbide chips, several brand-new packaging technologies and options for silicon carbide power components have emerged in recent years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have established from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have developed from gold cords to copper cords, and the driving pressure is expense decrease; high-power tools have actually established from aluminum cables (strips) to Cu Clips, and the driving pressure is to improve item efficiency. The greater the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to connect chips and pins. Compared to standard bonding product packaging methods, Cu Clip modern technology has the complying with advantages:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a particular level, changes the basic cable bonding technique in between the chip and the pins. As a result, a special plan resistance worth, greater present flow, and better thermal conductivity can be acquired.
2. The lead pin welding location does not require to be silver-plated, which can completely save the cost of silver plating and poor silver plating.
3. The item appearance is totally regular with normal items and is mostly made use of in servers, portable computers, batteries/drives, graphics cards, motors, power materials, and other fields.
Cu Clip has 2 bonding techniques.
All copper sheet bonding technique
Both eviction pad and the Source pad are clip-based. This bonding method is much more expensive and complex, but it can accomplish far better Rdson and far better thermal effects.
( copper strip)
Copper sheet plus wire bonding method
The source pad utilizes a Clip approach, and eviction makes use of a Cable method. This bonding method is somewhat more affordable than the all-copper bonding method, saving wafer area (relevant to very small entrance areas). The procedure is easier than the all-copper bonding technique and can get better Rdson and far better thermal result.
Supplier of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper zinc alloy, please feel free to contact us and send an inquiry.
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